Adhesive air guiding device and motherboard having the same

ABSTRACT

A motherboard including an electronic component is provided. Airflow flows through the motherboard along a direction. An adhesive air guiding device including at least one air guiding surface facing the direction of the airflow is stuck to the electronic component, for guiding the airflow to flow over the electronic component.

BACKGROUND

1. Technical Field

The present disclosure relates to an adhesive air guiding device, and a motherboard with the adhesive air guiding device.

2. Description of Related Art

Typically, a fan is mounted in a computer chassis to direct air from outside into the chassis, for forming airflow in a direction to cool a plurality of electronic components on a motherboard mounted on the chassis. However, most of the electronic components each have a sidewall perpendicular to the direction of the airflow, which will block the airflow and affect heat dissipation of the electronic components.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an assembled, isometric view of an embodiment of a motherboard together with a fan.

FIG. 2 is an exploded, isometric view of FIG. 1.

DETAILED DESCRIPTION

Referring to FIGS. 1 and 2, an embodiment of a motherboard 10 is provided. The motherboard 10 is mounted in a computer chassis (not shown), and a fan 20 is arranged in the chassis adjacent to a front edge of the motherboard 10. The fan 20 directs air from outside into the chassis to form airflow in a direction A towards the motherboard 10. A plurality of electronic components 15, such as connectors, are installed on the motherboard 10. Each of the plurality of electronic components 15 includes a sidewall 17 perpendicularly facing the airflow direction A.

A plurality of adhesive air guiding devices made of soft insulative fireresistant material are attached to the plurality of electronic components 15. The plurality of adhesive air guiding devices include first adhesive air guiding devices 30 and second adhesive air guiding devices 40 having different shapes from the first adhesive air guiding devices 30. Each of the first adhesive air guiding devices 30 is triangular-prism shaped, and includes a vertical adhesive surface 31, a bottom surface 32 perpendicularly extending from a bottom of the adhesive surface 31, and a slanted air guiding surface 33 connecting a top of the adhesive surface 31 and a front end of the bottom surface 32. The adhesive surface 31 of each first adhesive air guiding device 30 has the same shape and size as the sidewall 17 of a corresponding electronic component 15. Each of the second adhesive air guiding devices 40 is also triangular-prism shaped, and includes an rectangular adhesive surface 41, a triangular bottom surface 42 perpendicularly extending from a bottom of the adhesive surface 41, and two slanted air guiding surfaces 43 slanted extending from opposite sides of the adhesive surface 41 to connect to each other and perpendicular to the bottom surface 42. The adhesive surface 41 of each second adhesive air guiding device 30 has the same shape and size as the sidewall 17 of a corresponding electronic component 15.

In assembly, the adhesive surfaces 31 and 41 of the first and second adhesive air guiding devices 30 and 40 are correspondingly stuck to the sidewalls 17 of the corresponding electronic components 15, with the bottom surfaces 32 and 42 being supported on the motherboard 10, and the air guiding surfaces 33 and 43 facing the airflow direction A.

When the computer works, the airflow generated by the fan 20 flows towards the air guiding surfaces 33 and 43 in the direction A, and flows over the electronic components 15 along the air guiding surfaces 33 and 43. In the process, the slanted air guiding surfaces 33 and 43 can guide the airflow, and reduce windage resistance, which will enhance heat dispersion of the motherboard 10.

In this embodiment, the first and second adhesive air guiding devices 30 and 40 are made of soft insulative fireresistant material. When there are some little electronic components, such as resistors or capacitors, near the plurality of electronic components 15, the first and second adhesive air guiding devices 30 and 40 also can be assembled to the corresponding electronic components 15 with deformation.

It is to be understood, however, that even though numerous characteristics and advantages of the present disclosure have been set forth in the foregoing description, together with details of the structure and function of the disclosure, the disclosure is illustrative only, and changes may be made in details, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed. 

1. An adhesive air guiding device comprising: an adhesive surface; and at least one air guiding surface slanted relative to the adhesive surface.
 2. The adhesive air guiding device of claim 1, wherein the adhesive air guiding device is made of soft insulative fireresistant material.
 3. The adhesive air guiding device of claim 1, further comprising a bottom surface perpendicularly extending from a bottom of the adhesive surface.
 4. The adhesive air guiding device of claim 3, wherein the adhesive air guiding device is triangular-prism shaped, wherein the air guiding surface connects to a top of the adhesive surface and a front end of the bottom surface.
 5. The adhesive air guiding device of claim 3, wherein the adhesive air guiding device is triangular-prism shaped, wherein the at least one air guiding surface comprises two air guiding surfaces, the air guiding surfaces connect to opposite sides of the adhesive surface and connect to each other, and the air guiding surfaces are perpendicular to the bottom surface.
 6. A motherboard facing an airflow flowing along a direction, the motherboard comprising: an electronic component comprising a sidewall facing the direction of the airflow; and an adhesive air guiding device comprising an adhesive surface stuck to the sidewall of the electronic component, and at least one air guiding surface slanted relative to the adhesive surface and facing the direction of the airflow, to guide the airflow to flow over the electronic component.
 7. The motherboard of claim 6, wherein the adhesive air guiding device is made of soft insulative fireresistant material.
 8. The motherboard of claim 6, wherein the adhesive air guiding device further comprises a bottom surface perpendicularly extending from a bottom of the adhesive surface.
 9. The motherboard of claim 8, wherein the adhesive air guiding device is triangular-prism shaped, the air guiding surface connects to a top of the adhesive surface and a front end of the bottom surface.
 10. The motherboard of claim 8, wherein the adhesive air guiding device is triangular-prism shaped, the at least one air guiding surface comprises two air guiding surfaces, the air guiding surfaces slanted extend from opposite sides of the adhesive surface to connect to each other and are perpendicular to the bottom surface. 